Professor Baek Kyung Wook (department of Material Science and Engineering) succeeded in developing an ultra-thin conjugation technique that can perfectly replace the modular contact in electronic devices.
The research team developed a compound material using ultra-fine solder-adhesive film and developed the vertical ultrasonic conjugation process thereby making a reliable utra-thin conjugation.
The developed technique allowed for very thin and reliable conjugation and will be able to replace the socket type connector and is expected to revolutionize the electronic device industry.
In mobile electronic devices like the smartphone, the trend is to incorporate various functional modules like camera, display, touchscreens, etc. in addition to striving for miniaturization of the device.
Recently the problem was the fact that the number of modules within the device was increasing due to the incorporation of various functions, and consequently the volume that these modules took up increased as well, which made miniaturization almost impossible.
Professor Baek‘s team succeeded in improving upon this problem by creating a compound material that has ultra-fine solder particles that can melt to form alloy fusion with the electrode and thermosetting adhesive film that can wrap around the electrode and provide mechanical protection.
The use of this material made it possible to reduce the thickness of the connector by hundredth fold which improved electrical, mechanical properties and highly reliable.
From a processing standpoint the conventional conjugation process involved heating the mechanical block and was therefore hard to manage its production and also consumed 1000W and took up to 15 seconds.
By contrast, Professor Baek’s team’s new process uses only ultrasound to locally heat and melt the conjugation point itself thereby reducing power consumption to 100W and conjugation time to 1~5 seconds.
The technique developed by Professor Baek and Lee Ki Won Doctorate student was awarded Excellent Dissertation Award by world famous journals like the Electronic Components and Technology Conference and is being recognized worldwide.