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Professor Kyung Wook Baek Wins the Best Thesis Award at the 2012 Pan-Pacific Microelectronic Symposium
Prof. Kyung Wook Baek from KAIST"s material science department has won the Best Thesis Award at the 2012 Pan-Pacific Microelectronic Symposium. The title of this thesis was "Recent Advances in Anisotropic Conductive Adhesives Technology : Materials and Processes". Prof Baek had the honor of having his thesis be appointed the best thesis of the symposium. This thesis includes his 15 years of research on ACAs which are a key element of display and semiconductor packaging technology. Prof. Baek"s research results has been recognized as incredibly innovative in the field of ACAs and ultrasonic connection devices. This thesis has been recognized as setting the foundation for commercialization by professionals from all over the world at the symposium. Prof. Baek has announced two innovative technologies on ACAs at the symposium. One is a technology that merges the nanofiber technology with the ATAs. This technology was highly applauded for overcoming the problem of electric connection in micro-pitch display semiconductors, and successfully applying this to electronic packaging materials. Currently, commercialization process based on the patent is ongoing. It is expected that we will be able to take hold of the entire market once the commercialization succeeds. The other technology was to improve the liability and overcome the limits of the current flow in ACAs through the use of solder molecules. This is also undergoing commercialization process for use in mobile electronic devices. Together with this, Prof.Baek has reported an innovative case where the original heat compression process was replaced with a new ultrasonic process. This discovery is deemed to be extremely great due to its implications in replacing all heat compression systems. This too will soon be commercialized Prof.Baek has played a crucial role in the development of electronic packaging material and processing technology. He has written the largest number of theses in this area, and has proven himself to be the world"s best through winning this award.
KAIST, Nokia Launch Joint Research Project
Prof. Kyung Wook Baik of KAIST and his research team in the Department of Materials Science and Engineering announced the launch of a joint research project with Nokia, the world"s leading mobile phone supplier, on Jan. 24. It is the first time that Nokia runs a joint research project with a Korean university or research institute. Under the agreement, KAIST will develop a new ultrasonic welding process to bond various modules for mobile phones. The ultrasonic welding process, an indigenous technology patented by the research team led by Prof. Baik, is expected to contribute greatly to improving productivity in manufacturing mobile phones, as well as making it smaller and lighter. The research period is six month and the project fund amounts to 35,000 euros.
Ki-Won Lee Receives Best Student Paper Award
Ki-Won Lee Receives Best Student Paper Award Ki-Won Lee, a doctoral student of Materials Science & Engineering, has received the Best Student Paper Award ‘Motorola Fellowship Award’ at 2007 Electronic Components and Technology Conference (ECTC). Lee’s paper is about a new bonding process of anisotropic conductive film using ultrasonic wave, which applies ultrasonic wave, instead of thermal compression, at the room temperature to reduce the process time from ten to three seconds. The recipients of Motorola Fellowship Award are selected by IEEE Components, Packaging and Manufacturing Technology Society, and Motorola awards special scholarship to recipients. The ECTC is the world’s largest yearly conference concerning electronic packaging technologies with more than 1,000 attendees and more than 300 presented papers.
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