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KAIST Develops Room-Temperature 3D Printing Technology for ‘Electronic Eyes’—Miniaturized Infrared Sensors
<(From Left) Professor Ji Tae Kim of the Department of Mechanical Engineering, Professor Soong Ju Oh of Korea University and Professor Tianshuo Zhao of the University of Hong Kong>
The “electronic eyes” technology that can recognize objects even in darkness has taken a step forward. Infrared sensors, which act as the “seeing” component in devices such as LiDAR for autonomous vehicles, 3D face recognition systems in smartphones, and wearable healthcare devices, are regarded as key components in next-generation electronics. Now, a research team at KAIST and their collaborators have developed the world’s first room-temperature 3D printing technology that can fabricate miniature infrared sensors in any desired shape and size.
KAIST (President Kwang Hyung Lee) announced on the 3rd of November that the research team led by Professor Ji Tae Kim of the Department of Mechanical Engineering, in collaboration with Professor Soong Ju Oh of Korea University and Professor Tianshuo Zhao of the University of Hong Kong, has developed a 3D printing technique capable of fabricating ultra-small infrared sensors—smaller than 10 micrometers (µm)—in customized shapes and sizes at room temperature.
Infrared sensors convert invisible infrared signals into electrical signals and serve as essential components in realizing future electronic technologies such as robotic vision. Accordingly, miniaturization, weight reduction, and flexible form-factor design have become increasingly important.
Conventional semiconductor fabrication processes were well suited for mass production but struggled to adapt flexibly to rapidly changing technological demands. They also required high-temperature processing, which limited material choices and consumed large amounts of energy.
To overcome these challenges, the research team developed an ultra-precise 3D printing process that uses metal, semiconductor, and insulator materials in the form of liquid nanocrystal inks, stacking them layer by layer within a single printing platform.
This method enables direct fabrication of core components of infrared sensors at room temperature, allowing for the realization of customized miniature sensors of various shapes and sizes.
Particularly, the researchers achieved excellent electrical performance without the need for high-temperature annealing by applying a “ligand-exchange” process, where insulating molecules on the surface of nanoparticles are replaced with conductive ones.
As a result, the team successfully fabricated ultra-small infrared sensors measuring less than one-tenth the thickness of a human hair (under 10 µm).
<Figure 1. 3D printing of infrared sensors.a. Room-temperature printing process for the electrodes and photoactive layer that make up the infrared sensor.b. Structure and chemical composition of the printed infrared microsensor. c.Printed infrared sensor micropixel array.>
Professor Ji Tae Kim commented, “The developed 3D printing technology not only advances the miniaturization and lightweight design of infrared sensors but also paves the way for the creation of innovative new form-factor products that were previously unimaginable. Moreover, by reducing the massive energy consumption associated with high-temperature processes, this approach can lower production costs and enable eco-friendly manufacturing—contributing to the sustainable development of the infrared sensor industry.”
The research results were published online in Nature Communications on October 16, 2025, under the title “Ligand-exchange-assisted printing of colloidal nanocrystals to enable all-printed sub-micron optoelectronics” (DOI: https://doi.org/10.1038/s41467-025-64596-4).
This research was supported by the Ministry of Science and ICT of Korea through the Excellent Young Researcher Program (RS−2025−00556379), the National Strategic Technology Material Development Program (RS−2024−00407084), and the International Cooperation Research Program for Original Technology Development (RS−2024−00438059).
2025.11.03 View 1014 -
KAIST Successfully Implements 3D Brain-Mimicking Platform with 6x Higher Precision
<(From left) Dr. Dongjo Yoon, Professor Je-Kyun Park from the Department of Bio and Brain Engineering, (upper right) Professor Yoonkey Nam, Dr. Soo Jee Kim>
Existing three-dimensional (3D) neuronal culture technology has limitations in brain research due to the difficulty of precisely replicating the brain's complex multilayered structure and the lack of a platform that can simultaneously analyze both structure and function. A KAIST research team has successfully developed an integrated platform that can implement brain-like layered neuronal structures using 3D printing technology and precisely measure neuronal activity within them.
KAIST (President Kwang Hyung Lee) announced on the 16th of July that a joint research team led by Professors Je-Kyun Park and Yoonkey Nam from the Department of Bio and Brain Engineering has developed an integrated platform capable of fabricating high-resolution 3D multilayer neuronal networks using low-viscosity natural hydrogels with mechanical properties similar to brain tissue, and simultaneously analyzing their structural and functional connectivity.
Conventional bioprinting technology uses high-viscosity bioinks for structural stability, but this limits neuronal proliferation and neurite growth. Conversely, neural cell-friendly low-viscosity hydrogels are difficult to precisely pattern, leading to a fundamental trade-off between structural stability and biological function. The research team completed a sophisticated and stable brain-mimicking platform by combining three key technologies that enable the precise creation of brain structure with dilute gels, accurate alignment between layers, and simultaneous observation of neuronal activity.
The three core technologies are: ▲ 'Capillary Pinning Effect' technology, which enables the dilute gel (hydrogel) to adhere firmly to a stainless steel mesh (micromesh) to prevent it from flowing, thereby reproducing brain structures with six times greater precision (resolution of 500 μm or less) than conventional methods; ▲ the '3D Printing Aligner,' a cylindrical design that ensures the printed layers are precisely stacked without misalignment, guaranteeing the accurate assembly of multilayer structures and stable integration with microelectrode chips; and ▲ 'Dual-mode Analysis System' technology, which simultaneously measures electrical signals from below and observes cell activity with light (calcium imaging) from above, allowing for the simultaneous verification of the functional operation of interlayer connections through multiple methods.
< Figure 1. Platform integrating brain-structure-mimicking neural network model construction and functional measurement technology>
The research team successfully implemented a three-layered mini-brain structure using 3D printing with a fibrin hydrogel, which has elastic properties similar to those of the brain, and experimentally verified the process of actual neural cells transmitting and receiving signals within it.
Cortical neurons were placed in the upper and lower layers, while the middle layer was left empty but designed to allow neurons to penetrate and connect through it. Electrical signals were measured from the lower layer using a microsensor (electrode chip), and cell activity was observed from the upper layer using light (calcium imaging). The results showed that when electrical stimulation was applied, neural cells in both upper and lower layers responded simultaneously. When a synapse-blocking agent (synaptic blocker) was introduced, the response decreased, proving that the neural cells were genuinely connected and transmitting signals.
Professor Je-Kyun Park of KAIST explained, "This research is a joint development achievement of an integrated platform that can simultaneously reproduce the complex multilayered structure and function of brain tissue. Compared to existing technologies where signal measurement was impossible for more than 14 days, this platform maintains a stable microelectrode chip interface for over 27 days, allowing the real-time analysis of structure-function relationships. It can be utilized in various brain research fields such as neurological disease modeling, brain function research, neurotoxicity assessment, and neuroprotective drug screening in the future."
The research, in which Dr. Soo Jee Kim and Dr. Dongjo Yoon from KAIST's Department of Bio and Brain Engineering participated as co-first authors, was published online in the international journal 'Biosensors and Bioelectronics' on June 11, 2025.
※Paper: Hybrid biofabrication of multilayered 3D neuronal networks with structural and functional interlayer connectivity
※DOI: https://doi.org/10.1016/j.bios.2025.117688
2025.07.16 View 2419 -
Military Combatants Usher in an Era of Personalized Training with New Materials
< Photo 1. (From left) Professor Steve Park of Materials Science and Engineering, Kyusoon Pak, Ph.D. Candidate (Army Major) >
Traditional military training often relies on standardized methods, which has limited the provision of optimized training tailored to individual combatants' characteristics or specific combat situations. To address this, our research team developed an e-textile platform, securing core technology that can reflect the unique traits of individual combatants and various combat scenarios. This technology has proven robust enough for battlefield use and is economical enough for widespread distribution to a large number of troops.
On June 25th, Professor Steve Park's research team at KAIST's Department of Materials Science and Engineering announced the development of a flexible, wearable electronic textile (E-textile) platform using an innovative technology that 'draws' electronic circuits directly onto fabric.
The wearable e-textile platform developed by the research team combines 3D printing technology with new materials engineering design to directly print flexible and highly durable sensors and electrodes onto textile substrates. This enables the collection of precise movement and human body data from individual combatants, which can then be used to propose customized training models.
Existing e-textile fabrication methods were often complex or limited in their ability to provide personalized customization. To overcome these challenges, the research team adopted an additive manufacturing technology called 'Direct Ink Writing (DIW)' 3D printing.
< Figure 1. Schematic diagram of e-textile manufactured with Direct Ink Writing (DIW) printing technology on various textiles, including combat uniforms >
This technology involves directly dispensing and printing special ink, which functions as sensors and electrodes, onto textile substrates in desired patterns. This allows for flexible implementation of various designs without the complex process of mask fabrication. This is expected to be an effective technology that can be easily supplied to hundreds of thousands of military personnel.
The core of this technology lies in the development of high-performance functional inks based on advanced materials engineering design. The research team combined styrene-butadiene-styrene (SBS) polymer, which provides flexibility, with multi-walled carbon nanotubes (MWCNT) for electrical conductivity. They developed a tensile/bending sensor ink that can stretch up to 102% and maintain stable performance even after 10,000 repetitive tests. This means that accurate data can be consistently obtained even during the strenuous movements of combatants.
< Figure 2. Measurement of human movement and breathing patterns using e-textile >
Furthermore, new material technology was applied to implement 'interconnect electrodes' that electrically connect the upper and lower layers of the fabric. The team developed an electrode ink combining silver (Ag) flakes with rigid polystyrene (PS) polymer, precisely controlling the impregnation level (how much the ink penetrates the fabric) to effectively connect both sides or multiple layers of the fabric. This secures the technology for producing multi-layered wearable electronic systems integrating sensors and electrodes.
< Figure 3. Experimental results of recognizing unknown objects after machine learning six objects using a smart glove >
The research team proved the platform's performance through actual human movement monitoring experiments. They printed the developed e-textile on major joint areas of clothing (shoulders, elbows, knees) and measured movements and posture changes during various exercises such as running, jumping jacks, and push-ups in real-time.
Additionally, they demonstrated the potential for applications such as monitoring breathing patterns using a smart mask and recognizing objects through machine learning and perceiving complex tactile information by printing multiple sensors and electrodes on gloves. These results show that the developed e-textile platform is effective in precisely understanding the movement dynamics of combatants.
This research is an important example demonstrating how cutting-edge new material technology can contribute to the advancement of the defense sector. Major Kyusoon Pak of the Army, who participated in this research, considered required objectives such as military applicability and economic feasibility for practical distribution from the research design stage.
< Figure 4. Experimental results showing that a multi-layered e-textile glove connected with interconnect electrodes can measure tensile/bending signals and pressure signals at a single point >
Major Pak stated, "Our military is currently facing both a crisis and an opportunity due to the decrease in military personnel resources caused by the demographic cliff and the advancement of science and technology. Also, respect for life in the battlefield is emerging as a significant issue. This research aims to secure original technology that can provide customized training according to military branch/duty and type of combat, thereby enhancing the combat power and ensuring the survivability of our soldiers."
He added, "I hope this research will be evaluated as a case that achieved both scientific contribution and military applicability."
This research, where Kyusoon Pak, Ph.D. Candidate (Army Major) from KAIST's Department of Materials Science and Engineering, participated as the first author and Professor Steve Park supervised, was published on May 27, 2025, in `npj Flexible Electronics (top 1.8% in JCR field)', an international academic journal in the electrical, electronic, and materials engineering fields.
* Paper Title: Fabrication of Multifunctional Wearable Interconnect E-textile Platform Using Direct Ink Writing (DIW) 3D Printing
* DOI: https://doi.org/10.1038/s41528-025-00414-7
This research was supported by the Ministry of Trade, Industry and Energy and the National Research Foundation of Korea.
2025.06.25 View 4634 -
KAIST Research Team Develops an AI Framework Capable of Overcoming the Strength-Ductility Dilemma in Additive-manufactured Titanium Alloys
<(From Left) Ph.D. Student Jaejung Park and Professor Seungchul Lee of KAIST Department of Mechanical Engineering and , Professor Hyoung Seop Kim of POSTECH, and M.S.–Ph.D. Integrated Program Student Jeong Ah Lee of POSTECH. >
The KAIST research team led by Professor Seungchul Lee from Department of Mechanical Engineering, in collaboration with Professor Hyoung Seop Kim’s team at POSTECH, successfully overcame the strength–ductility dilemma of Ti 6Al 4V alloy using artificial intelligence, enabling the production of high strength, high ductility metal products. The AI developed by the team accurately predicts mechanical properties based on various 3D printing process parameters while also providing uncertainty information, and it uses both to recommend process parameters that hold high promise for 3D printing.
Among various 3D printing technologies, laser powder bed fusion is an innovative method for manufacturing Ti-6Al-4V alloy, renowned for its high strength and bio-compatibility. However, this alloy made via 3D printing has traditionally faced challenges in simultaneously achieving high strength and high ductility. Although there have been attempts to address this issue by adjusting both the printing process parameters and heat treatment conditions, the vast number of possible combinations made it difficult to explore them all through experiments and simulations alone.
The active learning framework developed by the team quickly explores a wide range of 3D printing process parameters and heat treatment conditions to recommend those expected to improve both strength and ductility of the alloy. These recommendations are based on the AI model’s predictions of ultimate tensile strength and total elongation along with associated uncertainty information for each set of process parameters and heat treatment conditions. The recommended conditions are then validated by performing 3D printing and tensile tests to obtain the true mechanical property values. These new data are incorporated into further AI model training, and through iterative exploration, the optimal process parameters and heat treatment conditions for producing high-performance alloys were determined in only five iterations. With these optimized conditions, the 3D printed Ti-6Al-4V alloy achieved an ultimate tensile strength of 1190 MPa and a total elongation of 16.5%, successfully overcoming the strength–ductility dilemma.
Professor Seungchul Lee commented, “In this study, by optimizing the 3D printing process parameters and heat treatment conditions, we were able to develop a high-strength, high-ductility Ti-6Al-4V alloy with minimal experimentation trials. Compared to previous studies, we produced an alloy with a similar ultimate tensile strength but higher total elongation, as well as that with a similar elongation but greater ultimate tensile strength.” He added, “Furthermore, if our approach is applied not only to mechanical properties but also to other properties such as thermal conductivity and thermal expansion, we anticipate that it will enable efficient exploration of 3D printing process parameters and heat treatment conditions.”
This study was published in Nature Communications on January 22 (https://doi.org/10.1038/s41467-025-56267-1), and the research was supported by the National Research Foundation of Korea’s Nano & Material Technology Development Program and the Leading Research Center Program.
2025.02.21 View 10157