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3D Worlds from Just a Few Phone Photos
<(From Left) Ph.D candidate Jumin Lee, Ph.D candidate Woo Jae Kim, Ph.D candidate Youngju Na, Ph.D candidate Kyu Beom Han, Professor Sung-eui Yoon>
Existing 3D scene reconstructions require a cumbersome process of precisely measuring physical spaces with LiDAR or 3D scanners, or correcting thousands of photos along with camera pose information. The research team at KAIST has overcome these limitations and introduced a technology enabling the reconstruction of 3D —from tabletop objects to outdoor scenes—with just two to three ordinary photographs. The breakthrough suggests a new paradigm in which spaces captured by camera can be immediately transformed into virtual environments.
KAIST announced on November 6 that the research team led by Professor Sung-Eui Yoon from the School of Computing has developed a new technology called SHARE (Shape-Ray Estimation), which can reconstruct high-quality 3D scenes using only ordinary images, without precise camera pose information.
Existing 3D reconstruction technology has been limited by the requirement of precise camera position and orientation information at the time of shooting to reproduce 3D scenes from a small number of images. This has necessitated specialized equipment or complex calibration processes, making real-world applications difficult and slowing widespread adoption.
To solve these problems, the research team developed a technology that constructs accurate 3D models by simultaneously estimating the 3D scene and the camera orientation using just two to three standard photographs. The technology has been recognized for its high efficiency and versatility, enabling rapid and precise reconstruction in real-world environments without additional training or complex calibration processes.
While existing methods calculate 3D structures from known camera poses, SHARE autonomously extracts spatial information from images themselves and infers both camera pose and scene structure. This enables stable 3D reconstruction without shape distortion by aligning multiple images taken from different positions into a single unified space.
<Representative Image of SHARE Technology>
"The SHARE technology is a breakthrough that dramatically lowers the barrier to entry for 3D reconstruction,” said Professor Sung-Eui Yoon. “It will enable the creation of high-quality content in various industries such as construction, media, and gaming using only a smartphone camera. It also has diverse application possibilities, such as building low-cost simulation environments in the fields of robotics and autonomous driving."
<SHARE Technology, Precise Camera Information and 3D Scene Prediction Technology>
Ph.D. Candidate Youngju Na and M.S candidate Taeyeon Kim participated as co-first authors on the research. The results were presented on September 17th at the IEEE International Conference on Image Processing (ICIP 2025), where the paper received the Best Student Paper Award.
The award, given to only one paper among 643 accepted papers this year—a selection rate of 0.16 percent—once again underscores the excellent research capabilities of the KAIST research team.
Paper Title: Pose-free 3D Gaussian Splatting via Shape-Ray Estimation, DOI: https://arxiv.org/abs/2505.22978
Award Information: https://www.linkedin.com/posts/ieeeicip_congratulations-to-the-icip-2025-best-activity-7374146976449335297-6hXz
This achievement was carried out with support from the Ministry of Science and ICT's SW Star Lab Project under the task 'Development of Perception, Action, and Interaction Algorithms for Unspecified Environments for Open World Robot Services.'
2025.11.10 View 1886 -
KAIST Develops Room-Temperature 3D Printing Technology for ‘Electronic Eyes’—Miniaturized Infrared Sensors
<(From Left) Professor Ji Tae Kim of the Department of Mechanical Engineering, Professor Soong Ju Oh of Korea University and Professor Tianshuo Zhao of the University of Hong Kong>
The “electronic eyes” technology that can recognize objects even in darkness has taken a step forward. Infrared sensors, which act as the “seeing” component in devices such as LiDAR for autonomous vehicles, 3D face recognition systems in smartphones, and wearable healthcare devices, are regarded as key components in next-generation electronics. Now, a research team at KAIST and their collaborators have developed the world’s first room-temperature 3D printing technology that can fabricate miniature infrared sensors in any desired shape and size.
KAIST (President Kwang Hyung Lee) announced on the 3rd of November that the research team led by Professor Ji Tae Kim of the Department of Mechanical Engineering, in collaboration with Professor Soong Ju Oh of Korea University and Professor Tianshuo Zhao of the University of Hong Kong, has developed a 3D printing technique capable of fabricating ultra-small infrared sensors—smaller than 10 micrometers (µm)—in customized shapes and sizes at room temperature.
Infrared sensors convert invisible infrared signals into electrical signals and serve as essential components in realizing future electronic technologies such as robotic vision. Accordingly, miniaturization, weight reduction, and flexible form-factor design have become increasingly important.
Conventional semiconductor fabrication processes were well suited for mass production but struggled to adapt flexibly to rapidly changing technological demands. They also required high-temperature processing, which limited material choices and consumed large amounts of energy.
To overcome these challenges, the research team developed an ultra-precise 3D printing process that uses metal, semiconductor, and insulator materials in the form of liquid nanocrystal inks, stacking them layer by layer within a single printing platform.
This method enables direct fabrication of core components of infrared sensors at room temperature, allowing for the realization of customized miniature sensors of various shapes and sizes.
Particularly, the researchers achieved excellent electrical performance without the need for high-temperature annealing by applying a “ligand-exchange” process, where insulating molecules on the surface of nanoparticles are replaced with conductive ones.
As a result, the team successfully fabricated ultra-small infrared sensors measuring less than one-tenth the thickness of a human hair (under 10 µm).
<Figure 1. 3D printing of infrared sensors.a. Room-temperature printing process for the electrodes and photoactive layer that make up the infrared sensor.b. Structure and chemical composition of the printed infrared microsensor. c.Printed infrared sensor micropixel array.>
Professor Ji Tae Kim commented, “The developed 3D printing technology not only advances the miniaturization and lightweight design of infrared sensors but also paves the way for the creation of innovative new form-factor products that were previously unimaginable. Moreover, by reducing the massive energy consumption associated with high-temperature processes, this approach can lower production costs and enable eco-friendly manufacturing—contributing to the sustainable development of the infrared sensor industry.”
The research results were published online in Nature Communications on October 16, 2025, under the title “Ligand-exchange-assisted printing of colloidal nanocrystals to enable all-printed sub-micron optoelectronics” (DOI: https://doi.org/10.1038/s41467-025-64596-4).
This research was supported by the Ministry of Science and ICT of Korea through the Excellent Young Researcher Program (RS−2025−00556379), the National Strategic Technology Material Development Program (RS−2024−00407084), and the International Cooperation Research Program for Original Technology Development (RS−2024−00438059).
2025.11.03 View 3824 -
Thinking outside the box to Fabricate Customized 3D Neural Chips
<(From Left) Professor Yoonkey Nam, Dr. Dongjo Yoon from the Department of Bio and Brain Engineering>
Cultured neural tissues have been widely used as a simplified experimental model for brain research. However, existing devices for growing and recording neural tissues, which are manufactured using semiconductor processes, have limitations in terms of shape modification and the implementation of three-dimensional (3D) structures.
By "thinking outside the box," a KAIST research team has successfully created a customized 3D neural chip. They first used a 3D printer to fabricate a hollow channel structure, then used capillary action to automatically fill the channels with conductive ink, creating the electrodes and wiring. This achievement is expected to significantly increase the design freedom and versatility of brain science and brain engineering research platforms.
On the 25th, KAIST announced that a research team led by Professor Yoonkey Nam from the Department of Bio and Brain Engineering has successfully developed a platform technology that overcomes the limitations of traditional semiconductor-based manufacturing. This technology allows for the precise fabrication of "3D microelectrode array" (neural interfaces with multiple microelectrodes arranged in a 3D space to measure and stimulate the electrophysiological signal of neurons) in various customized forms for in vitro culture chips.
Existing 3D microelectrode array fabrication, based on semiconductor processes, has limited 3D design freedom and is expensive. While 3D printing-based fabrication techniques have recently been proposed to overcome these issues, they still have limitations in terms of 3D design freedom for various in vitro neural network structures because they follow the traditional sequence of "conductive material patterning → insulator coating → electrode opening."
The KAIST research team leveraged the excellent 3D design freedom provided by 3D printing technology and its ability to use printed materials as insulators. By reversing the traditional process, they established an innovative method that allows for more flexible design and functional measurement of 3D neuronal network models for in vitro culture.
<Schematic Diagram of an Integrated Cell Culture Substrate-Microelectrode Array Platform for In Vitro Cultured 3D Neural Network Models>
First, they used a 3D printer to print a hollow 3D insulator with micro-tunnels. This structure was designed to serve as a stable scaffold for conductive materials in 3D space while also supporting the creation of various 3D neuronal networks. They then demonstrated that by using capillary action to fill these internal micro-tunnels with conductive ink, they could create a 3D scaffold-microelectrode array with more freely arranged microelectrodes within a complex 3D culture support structure.
The new platform can be used to create various chip shapes, such as probe-type, cube-type, and modular-type, and supports the fabrication of electrodes using different materials like graphite, conductive polymers, and silver nanoparticles. This allows for the simultaneous measurement of multichannel neural signals from both inside and outside the 3D neuronal network, enabling precise analysis of the dynamic interactions and connectivity between neurons.
Professor Nam stated, "This research, which combines 3D printing and capillary action, is an achievement that significantly expands the freedom of neural chip fabrication." He added that it will contribute to the advancement of fundamental brain science research using neural tissue, as well as applied fields like cell-based biosensors and biocomputing.
Dr. Dongjo Yoon from KAIST's Department of Bio and Brain Engineering participated as the first author of the study. The research findings were published online in the international academic journal Advanced Functional Materials (June 25th issue).
※Paper Title: Highly Customizable Scaffold-Type 3D Microelectrode Array Platform for Design and Analysis of the 3D Neuronal Network In Vitro
This research was supported by the Consolidator Grants Program and the Global Basic Research Laboratory Program of the National Research Foundation of Korea.
2025.09.26 View 1887 -
A Breakthrough in Parkinson's Research: Precision Diagnosis and Treatment with AI and Optogenetics
<Research team photo (from top left) Dr. Bobae Hyeon, Professor Daesoo Kim, Director Chang-joon Lee, (right) Professor Won Do Heo>
Globally recognized figures like Muhammad Ali and Michael J. Fox have long suffered from Parkinson's disease. The disease presents a complex set of motor symptoms, including tremors, rigidity, bradykinesia, and postural instability. However, traditional diagnostic methods have struggled to sensitively detect changes in the early stages, and drugs targeting brain signal regulation have had limited clinical effectiveness.
Recently, Korean researchers successfully demonstrated the potential of a technology that integrates AI and optogenetics as a tool for precise diagnosis and therapeutic evaluation of Parkinson's disease in mice. They have also proposed a strategy for developing next-generation personalized treatments.
KAIST (President Kwang Hyung Lee) announced on the 22nd of September that a collaborative research team—comprising Professor Won Do Heo's team from the Department of Biological Sciences, Professor Daesoo Kim's team from the Department of Brain and Cognitive Sciences, and Director Chang-Jun Lee's team from the Institute for Basic Science (IBS) Center for Cognition and Sociality—achieved a preclinical research breakthrough by combining AI analysis with optogenetics. Their work simultaneously demonstrated the possibility of early and precise diagnosis and treatment in an animal model of Parkinson's disease.
The research team created a Parkinson's disease mouse model with two stages of severity. These were male mice with alpha-synuclein protein abnormalities, a standard model used to simulate human Parkinson's disease for diagnostic and therapeutic research.
In collaboration with Professor Kim's team at KAIST, they introduced AI-based 3D pose estimation for behavioral analysis. The team analyzed over 340 behavioral features—such as gait, limb movements, and tremors—from the Parkinson's mice and condensed them into a single metric: the AI-predicted Parkinson's disease score (APS).
The analysis showed that the APS exhibited a significant difference from the control group as early as two weeks after the disease was induced. It also proved more sensitive in assessing the disease's severity than traditional motor function tests. The study identified key diagnostic features, including changes in stride, asymmetrical limb movements, and chest tremors. The top 20 behavioral features included hand/foot asymmetry, changes in stride and posture, and an increase in high-frequency chest movement.
To confirm that these behavioral indicators were not just general motor decline but specific to Parkinson's, the team applied the same analysis to a mouse model of Amyotrophic Lateral Sclerosis (ALS), also known as Lou Gehrig's disease, in collaboration with Director Lee's team at IBS. Since both Parkinson's and ALS cause motor function problems, if the APS simply reflected poor motor skills, a high score should have appeared in both diseases.
However, the analysis of the ALS animal model showed that despite a decline in motor function, the mice did not exhibit the high APS seen in the Parkinson's model. Instead, their scores remained low, and their behavioral changes were distinctly different. This demonstrates that APS is directly related to specific, characteristic changes that only appear in Parkinson's disease.
For treatment, the research team used optoRET, an optogenetics technology that precisely controls neurotrophic signals with light. This technique proved effective in the animal model, leading to smoother gait and limb movements and a reduction in tremors.
Specifically, a regimen of shining light on alternate days was found to be the most effective, and it also showed a tendency to protect dopamine-producing neurons in the brain.
Professor Won Do Heo of KAIST stated, "This is the first time in the world that a preclinical framework has been implemented that connects early diagnosis, treatment evaluation, and mechanism verification of Parkinson's disease by combining AI-based behavioral analysis with optogenetics." He added, "This lays a crucial foundation for future personalized medicine and customized treatments for patients."
The study, with Dr. Bobae Hyeon, a postdoctoral researcher at the KAIST Institute for Biological Science, as the first author, was published online in the international journal Nature Communications on August 21st. Dr. Hyeon is conducting follow-up research to advance Parkinson's cell therapy at McLean Hospital, Harvard Medical School, supported by the "Global Physician-Scientist Training Program" of the Korea Health Industry Development Institute.
This research was supported by the KAIST Global Singularity Project, the Ministry of Science and ICT/National Research Foundation of Korea, the IBS Center for Cognition and Sociality, and the Ministry of Health and Welfare/Korea Health Industry Development Institute.
Paper Title: Integrating artificial intelligence and optogenetics for Parkinson's disease diagnosis and therapeutics in male mice
DOI: https://doi.org/10.1038/s41467-025-63025-w
2025.09.22 View 1749 -
KAIST Successfully Implements 3D Brain-Mimicking Platform with 6x Higher Precision
<(From left) Dr. Dongjo Yoon, Professor Je-Kyun Park from the Department of Bio and Brain Engineering, (upper right) Professor Yoonkey Nam, Dr. Soo Jee Kim>
Existing three-dimensional (3D) neuronal culture technology has limitations in brain research due to the difficulty of precisely replicating the brain's complex multilayered structure and the lack of a platform that can simultaneously analyze both structure and function. A KAIST research team has successfully developed an integrated platform that can implement brain-like layered neuronal structures using 3D printing technology and precisely measure neuronal activity within them.
KAIST (President Kwang Hyung Lee) announced on the 16th of July that a joint research team led by Professors Je-Kyun Park and Yoonkey Nam from the Department of Bio and Brain Engineering has developed an integrated platform capable of fabricating high-resolution 3D multilayer neuronal networks using low-viscosity natural hydrogels with mechanical properties similar to brain tissue, and simultaneously analyzing their structural and functional connectivity.
Conventional bioprinting technology uses high-viscosity bioinks for structural stability, but this limits neuronal proliferation and neurite growth. Conversely, neural cell-friendly low-viscosity hydrogels are difficult to precisely pattern, leading to a fundamental trade-off between structural stability and biological function. The research team completed a sophisticated and stable brain-mimicking platform by combining three key technologies that enable the precise creation of brain structure with dilute gels, accurate alignment between layers, and simultaneous observation of neuronal activity.
The three core technologies are: ▲ 'Capillary Pinning Effect' technology, which enables the dilute gel (hydrogel) to adhere firmly to a stainless steel mesh (micromesh) to prevent it from flowing, thereby reproducing brain structures with six times greater precision (resolution of 500 μm or less) than conventional methods; ▲ the '3D Printing Aligner,' a cylindrical design that ensures the printed layers are precisely stacked without misalignment, guaranteeing the accurate assembly of multilayer structures and stable integration with microelectrode chips; and ▲ 'Dual-mode Analysis System' technology, which simultaneously measures electrical signals from below and observes cell activity with light (calcium imaging) from above, allowing for the simultaneous verification of the functional operation of interlayer connections through multiple methods.
< Figure 1. Platform integrating brain-structure-mimicking neural network model construction and functional measurement technology>
The research team successfully implemented a three-layered mini-brain structure using 3D printing with a fibrin hydrogel, which has elastic properties similar to those of the brain, and experimentally verified the process of actual neural cells transmitting and receiving signals within it.
Cortical neurons were placed in the upper and lower layers, while the middle layer was left empty but designed to allow neurons to penetrate and connect through it. Electrical signals were measured from the lower layer using a microsensor (electrode chip), and cell activity was observed from the upper layer using light (calcium imaging). The results showed that when electrical stimulation was applied, neural cells in both upper and lower layers responded simultaneously. When a synapse-blocking agent (synaptic blocker) was introduced, the response decreased, proving that the neural cells were genuinely connected and transmitting signals.
Professor Je-Kyun Park of KAIST explained, "This research is a joint development achievement of an integrated platform that can simultaneously reproduce the complex multilayered structure and function of brain tissue. Compared to existing technologies where signal measurement was impossible for more than 14 days, this platform maintains a stable microelectrode chip interface for over 27 days, allowing the real-time analysis of structure-function relationships. It can be utilized in various brain research fields such as neurological disease modeling, brain function research, neurotoxicity assessment, and neuroprotective drug screening in the future."
The research, in which Dr. Soo Jee Kim and Dr. Dongjo Yoon from KAIST's Department of Bio and Brain Engineering participated as co-first authors, was published online in the international journal 'Biosensors and Bioelectronics' on June 11, 2025.
※Paper: Hybrid biofabrication of multilayered 3D neuronal networks with structural and functional interlayer connectivity
※DOI: https://doi.org/10.1016/j.bios.2025.117688
2025.07.16 View 3559 -
Military Combatants Usher in an Era of Personalized Training with New Materials
< Photo 1. (From left) Professor Steve Park of Materials Science and Engineering, Kyusoon Pak, Ph.D. Candidate (Army Major) >
Traditional military training often relies on standardized methods, which has limited the provision of optimized training tailored to individual combatants' characteristics or specific combat situations. To address this, our research team developed an e-textile platform, securing core technology that can reflect the unique traits of individual combatants and various combat scenarios. This technology has proven robust enough for battlefield use and is economical enough for widespread distribution to a large number of troops.
On June 25th, Professor Steve Park's research team at KAIST's Department of Materials Science and Engineering announced the development of a flexible, wearable electronic textile (E-textile) platform using an innovative technology that 'draws' electronic circuits directly onto fabric.
The wearable e-textile platform developed by the research team combines 3D printing technology with new materials engineering design to directly print flexible and highly durable sensors and electrodes onto textile substrates. This enables the collection of precise movement and human body data from individual combatants, which can then be used to propose customized training models.
Existing e-textile fabrication methods were often complex or limited in their ability to provide personalized customization. To overcome these challenges, the research team adopted an additive manufacturing technology called 'Direct Ink Writing (DIW)' 3D printing.
< Figure 1. Schematic diagram of e-textile manufactured with Direct Ink Writing (DIW) printing technology on various textiles, including combat uniforms >
This technology involves directly dispensing and printing special ink, which functions as sensors and electrodes, onto textile substrates in desired patterns. This allows for flexible implementation of various designs without the complex process of mask fabrication. This is expected to be an effective technology that can be easily supplied to hundreds of thousands of military personnel.
The core of this technology lies in the development of high-performance functional inks based on advanced materials engineering design. The research team combined styrene-butadiene-styrene (SBS) polymer, which provides flexibility, with multi-walled carbon nanotubes (MWCNT) for electrical conductivity. They developed a tensile/bending sensor ink that can stretch up to 102% and maintain stable performance even after 10,000 repetitive tests. This means that accurate data can be consistently obtained even during the strenuous movements of combatants.
< Figure 2. Measurement of human movement and breathing patterns using e-textile >
Furthermore, new material technology was applied to implement 'interconnect electrodes' that electrically connect the upper and lower layers of the fabric. The team developed an electrode ink combining silver (Ag) flakes with rigid polystyrene (PS) polymer, precisely controlling the impregnation level (how much the ink penetrates the fabric) to effectively connect both sides or multiple layers of the fabric. This secures the technology for producing multi-layered wearable electronic systems integrating sensors and electrodes.
< Figure 3. Experimental results of recognizing unknown objects after machine learning six objects using a smart glove >
The research team proved the platform's performance through actual human movement monitoring experiments. They printed the developed e-textile on major joint areas of clothing (shoulders, elbows, knees) and measured movements and posture changes during various exercises such as running, jumping jacks, and push-ups in real-time.
Additionally, they demonstrated the potential for applications such as monitoring breathing patterns using a smart mask and recognizing objects through machine learning and perceiving complex tactile information by printing multiple sensors and electrodes on gloves. These results show that the developed e-textile platform is effective in precisely understanding the movement dynamics of combatants.
This research is an important example demonstrating how cutting-edge new material technology can contribute to the advancement of the defense sector. Major Kyusoon Pak of the Army, who participated in this research, considered required objectives such as military applicability and economic feasibility for practical distribution from the research design stage.
< Figure 4. Experimental results showing that a multi-layered e-textile glove connected with interconnect electrodes can measure tensile/bending signals and pressure signals at a single point >
Major Pak stated, "Our military is currently facing both a crisis and an opportunity due to the decrease in military personnel resources caused by the demographic cliff and the advancement of science and technology. Also, respect for life in the battlefield is emerging as a significant issue. This research aims to secure original technology that can provide customized training according to military branch/duty and type of combat, thereby enhancing the combat power and ensuring the survivability of our soldiers."
He added, "I hope this research will be evaluated as a case that achieved both scientific contribution and military applicability."
This research, where Kyusoon Pak, Ph.D. Candidate (Army Major) from KAIST's Department of Materials Science and Engineering, participated as the first author and Professor Steve Park supervised, was published on May 27, 2025, in `npj Flexible Electronics (top 1.8% in JCR field)', an international academic journal in the electrical, electronic, and materials engineering fields.
* Paper Title: Fabrication of Multifunctional Wearable Interconnect E-textile Platform Using Direct Ink Writing (DIW) 3D Printing
* DOI: https://doi.org/10.1038/s41528-025-00414-7
This research was supported by the Ministry of Trade, Industry and Energy and the National Research Foundation of Korea.
2025.06.25 View 6387 -
KAIST Develops Customized Tactile Sensor That Can Detect Light Breath, Pressure and Sound
< Photo 1. (From left) Professor Inkyu Park of KAIST Department of Mechanical Engineering (ME), Dr. Jungrak Choi of ETRI, Ph.D. Candidate Donho Lee and M.S. Graduate Chankyu Han of KAIST ME >
When a robot grabs an object or a medical device detects a pulse, the tactile sensor is the technology that senses pressure like a fingertip. Existing sensors had disadvantages, such as slow responses or declining accuracy after repeated use, but Korean researchers have succeeded in developing a sensor that can quickly and accurately detect even light breath, pressure, and sound. This sensor can be used across a broad range — from everyday movements to medical diagnostics.
KAIST (represented by President Kwang Hyung Lee) announced on the 23rd of June that Professor Inkyu Park’s team from the Department of Mechanical Engineering, through a collaborative research project with the Electronics and Telecommunications Research Institute (ETRI, President Seung Chan Bang ) under the National Research Council of Science & Technology (NST, Chairman Young Sik Kim), has developed an innovative technology that overcomes the structural limitations of existing tactile sensors.
The core of this joint research is the implementation of a customized tactile sensor that simultaneously achieves flexibility, precision, and repeatable durability by applying Thermoformed 3D Electronics (T3DE).
< Figure 1. Comparative evaluation of soft elastomer–based 3D structure versus thermoforming-based 3D structure in terms of mechanical properties. >
In particular, soft elastomer-based sensors (rubber, silicone, etc. — materials that stretch and return to their original shape) have structural problems such as slow response times, high hysteresis*, and creep**, but this new platform operates precisely in diverse environments and overcomes these limitations.
*Hysteresis: A phenomenon where the previously applied force or change is retained like a “memory,” so that the same stimulus does not always produce the same result.
**Creep: The phenomenon where a material slowly deforms when a force is continuously applied.
T3DE sensors are manufactured by precisely forming electrodes on a 2D film, then thermoforming them into a 3D structure under heat and pressure. Specifically, the top electrodes and supporting pillar structures of the sensor are designed to allow the fine-tuning of the mechanical properties for different purposes. By adjusting microstructural parameters — such as the thickness, length, and number of support pillars — the sensor’s Young’s modulus* can be tuned across a broad range of 10 Pa to 1 MPa. This matches the stiffness of biological tissues like skin, muscle, and tendons, making them highly suitable as bio-interface sensors.
*Young’s modulus: An index representing a material's stiffness; this research can control this index to match various biological tissues.
The newly developed T3DE sensor uses air as a dielectric material to reduce power consumption and demonstrates outstanding performance in sensitivity, response time, thermal stability, and repeatable accuracy.
Experimental results showed that the sensor achieved △sensitivity of 5,884 kPa⁻¹, △response time of 0.1 ms (less than one-thousandth of a second), △hysteresis of less than 0.5%, and maintained a repeatable precision of 99.9% or higher even after 5,000 repeated measurements.
< Figure 2. Graphic Overview of thermoformed 3D electronics (T3DE) >
The research team also constructed a high-resolution 40×70 array, comprising a total of 2,800 densely packed sensors, to visualize the pressure distribution on the sole of the foot in real time during exercise and confirmed the possibility of using the sensor for wrist pulse measurement to assess vascular health. Furthermore, successful results were also achieved in sound-detection experiments at a level comparable to commercial acoustic sensors. In short, the sensor can precisely and quickly measure foot pressure, pulse, and sound, allowing it to be applied in areas such as sports, health, and sound sensing.
The T3DE technology was also applied to an augmented-reality(AR)-based surgical training system. By adjusting the stiffness of each sensor element to match that of biological tissues, the system provided real-time visual and tactile feedback according to the pressure applied during surgical incisions. It also offered real-time warnings if an incision was too deep or approached a risky area, making it a promising technology for enhancing immersion and accuracy in medical training.
KAIST Professor Inkyu Park stated, “Because this sensor can be precisely tuned from the design stage and operates reliably across diverse environments, it can be used not only in everyday life, but also in a variety of fields such as healthcare, rehabilitation, and virtual reality.”
The research was co-led as first authors by Dr. Jungrak Choi of ETRI, KAIST master’s student Chankyu Han, and Ph.D. candidate Donho Lee, under the overall guidance of Professor Inkyu Park. The research results were published in the May 2025 issue of ‘Science Advances’ and introduced to the global research community through the journal’s official SNS channels (Facebook, Twitter).
※ Thesis Title: Thermoforming 2D films into 3D electronics for high-performance, customizable tactile sensing
※ DOI: 10.1126/sciadv.adv0057
< Figure 3. The introduction of the study on the official SNS posting by Science Advances >
This research was supported by the Ministry of Trade, Industry and Energy, the National Research Foundation of Korea, and the Korea Institute for Advancement of Technology.
2025.06.23 View 6712 -
KAIST achieves quantum entanglement essential for quantum error correction
Quantum computing is a technology capable of solving complex problems that classical computers struggle with. To perform accurate computations, quantum computers must correct errors that arise during operations. However, generating the quantum entanglement necessary for quantum error correction has long been considered a major challenge.
< Photo 1. (From left) Students Young-Do Yoon and Chan Roh of the Master's and Doctoral Integrated Program of the Department of Physics poses with Professor Young-Sik Ra and Student Geunhee Gwak of the same program >
KAIST (represented by President Kwang Hyung Lee) announced on the 25th of February that a research team led by Professor Young-Sik Ra from the Department of Physics has successfully implemented a three-dimensional cluster quantum entangled state, a key component for quantum error correction, through experimental demonstration.
Measurement-based quantum computing is an emerging paradigm that implements quantum computations by measuring specially entangled cluster states. The core of this approach lies in the generation of these cluster quantum entangled states, with two-dimensional cluster states commonly used for universal quantum computing.
However, to advance towards fault-tolerant quantum computing, which can correct quantum errors occurring during computations, a more complex three-dimensional cluster state is required. While previous studies have reported the generation of two-dimensional cluster states, experimental implementation of the three-dimensional cluster states necessary for fault-tolerant quantum computing had remained elusive due to the extreme complexity of their entanglement structure.
< Figure 1. (a) Experimental schematic. A pulse laser with a wavelength of 800 nm is converted into a pulse laser with a wavelength of 400 nm through second harmonic generation, and this is incident on a nonlinear crystal (PPKTP) to generate multiple quantum entanglement sources. (b) Generation of a 3D cluster state through optical mode basis change >
The research team overcame this challenge by developing a technique to control femtosecond time-frequency modes, successfully generating a three-dimensional cluster quantum entangled state for the first time.
The team directed a femtosecond laser into a nonlinear crystal, simultaneously generating quantum light sources across multiple frequency modes. (A femtosecond laser is a device that emits ultrashort, high-intensity light pulses.) Using this approach, they successfully created a three-dimensional cluster quantum entangled state.
Professor Young-Sik Ra noted, “This study marks the first successful demonstration of a three-dimensional cluster quantum entangled state, which was previously difficult to achieve with existing technology. This breakthrough is expected to serve as a crucial stepping stone for future research in measurement-based and fault-tolerant quantum computing.”
< Figure 2. Results of 3D cluster state generation. (a) Nullifier measurement of the cluster state. (b) 3D cluster state reconstructed using quantum state tomography. (c) Confirmation of quantum entanglement characteristics of the 3D cluster state >
The study was published online in Nature Photonics on February 24, 2025. The first author is Chan Roh, a Ph.D. candidate in KAIST’s integrated master’s and doctoral program, with Geunhee Gwak and Youngdo Yoon contributing as co-authors. (Paper title: “Generation of Three-Dimensional Cluster Entangled State”, DOI: 10.1038/s41566-025-01631-2)
This research was supported by the National Research Foundation of Korea (Quantum Computing Technology Development Program, Mid-Career Researcher Support Program, and Quantum Simulator for Materials Innovation Program), the Institute for Information & Communications Technology Planning & Evaluation (Quantum Internet Core Technology Program, University ICT Research Center Support Program), and the U.S. Air Force Research Laboratory.
2025.02.25 View 8201 -
KAIST Research Team Develops an AI Framework Capable of Overcoming the Strength-Ductility Dilemma in Additive-manufactured Titanium Alloys
<(From Left) Ph.D. Student Jaejung Park and Professor Seungchul Lee of KAIST Department of Mechanical Engineering and , Professor Hyoung Seop Kim of POSTECH, and M.S.–Ph.D. Integrated Program Student Jeong Ah Lee of POSTECH. >
The KAIST research team led by Professor Seungchul Lee from Department of Mechanical Engineering, in collaboration with Professor Hyoung Seop Kim’s team at POSTECH, successfully overcame the strength–ductility dilemma of Ti 6Al 4V alloy using artificial intelligence, enabling the production of high strength, high ductility metal products. The AI developed by the team accurately predicts mechanical properties based on various 3D printing process parameters while also providing uncertainty information, and it uses both to recommend process parameters that hold high promise for 3D printing.
Among various 3D printing technologies, laser powder bed fusion is an innovative method for manufacturing Ti-6Al-4V alloy, renowned for its high strength and bio-compatibility. However, this alloy made via 3D printing has traditionally faced challenges in simultaneously achieving high strength and high ductility. Although there have been attempts to address this issue by adjusting both the printing process parameters and heat treatment conditions, the vast number of possible combinations made it difficult to explore them all through experiments and simulations alone.
The active learning framework developed by the team quickly explores a wide range of 3D printing process parameters and heat treatment conditions to recommend those expected to improve both strength and ductility of the alloy. These recommendations are based on the AI model’s predictions of ultimate tensile strength and total elongation along with associated uncertainty information for each set of process parameters and heat treatment conditions. The recommended conditions are then validated by performing 3D printing and tensile tests to obtain the true mechanical property values. These new data are incorporated into further AI model training, and through iterative exploration, the optimal process parameters and heat treatment conditions for producing high-performance alloys were determined in only five iterations. With these optimized conditions, the 3D printed Ti-6Al-4V alloy achieved an ultimate tensile strength of 1190 MPa and a total elongation of 16.5%, successfully overcoming the strength–ductility dilemma.
Professor Seungchul Lee commented, “In this study, by optimizing the 3D printing process parameters and heat treatment conditions, we were able to develop a high-strength, high-ductility Ti-6Al-4V alloy with minimal experimentation trials. Compared to previous studies, we produced an alloy with a similar ultimate tensile strength but higher total elongation, as well as that with a similar elongation but greater ultimate tensile strength.” He added, “Furthermore, if our approach is applied not only to mechanical properties but also to other properties such as thermal conductivity and thermal expansion, we anticipate that it will enable efficient exploration of 3D printing process parameters and heat treatment conditions.”
This study was published in Nature Communications on January 22 (https://doi.org/10.1038/s41467-025-56267-1), and the research was supported by the National Research Foundation of Korea’s Nano & Material Technology Development Program and the Leading Research Center Program.
2025.02.21 View 11833 -
KAIST Secures Core Technology for Ultra-High-Resolution Image Sensors
A joint research team from Korea and the United States has developed next-generation, high-resolution image sensor technology with higher power efficiency and a smaller size compared to existing sensors. Notably, they have secured foundational technology for ultra-high-resolution shortwave infrared (SWIR) image sensors, an area currently dominated by Sony, paving the way for future market entry.
KAIST (represented by President Kwang Hyung Lee) announced on the 20th of November that a research team led by Professor SangHyeon Kim from the School of Electrical Engineering, in collaboration with Inha University and Yale University in the U.S., has developed an ultra-thin broadband photodiode (PD), marking a significant breakthrough in high-performance image sensor technology.
This research drastically improves the trade-off between the absorption layer thickness and quantum efficiency found in conventional photodiode technology. Specifically, it achieved high quantum efficiency of over 70% even in an absorption layer thinner than one micrometer (μm), reducing the thickness of the absorption layer by approximately 70% compared to existing technologies.
A thinner absorption layer simplifies pixel processing, allowing for higher resolution and smoother carrier diffusion, which is advantageous for light carrier acquisition while also reducing the cost. However, a fundamental issue with thinner absorption layers is the reduced absorption of long-wavelength light.
< Figure 1. Schematic diagram of the InGaAs photodiode image sensor integrated on the Guided-Mode Resonance (GMR) structure proposed in this study (left), a photograph of the fabricated wafer, and a scanning electron microscope (SEM) image of the periodic patterns (right) >
The research team introduced a guided-mode resonance (GMR) structure* that enables high-efficiency light absorption across a wide spectral range from 400 nanometers (nm) to 1,700 nanometers (nm). This wavelength range includes not only visible light but also light the SWIR region, making it valuable for various industrial applications.
*Guided-Mode Resonance (GMR) Structure: A concept used in electromagnetics, a phenomenon in which a specific (light) wave resonates (forming a strong electric/magnetic field) at a specific wavelength. Since energy is maximized under these conditions, it has been used to increase antenna or radar efficiency.
The improved performance in the SWIR region is expected to play a significant role in developing next-generation image sensors with increasingly high resolutions. The GMR structure, in particular, holds potential for further enhancing resolution and other performance metrics through hybrid integration and monolithic 3D integration with complementary metal-oxide-semiconductor (CMOS)-based readout integrated circuits (ROIC).
< Figure 2. Benchmark for state-of-the-art InGaAs-based SWIR pixels with simulated EQE lines as a function of TAL variation. Performance is maintained while reducing the absorption layer thickness from 2.1 micrometers or more to 1 micrometer or less while reducing it by 50% to 70% >
The research team has significantly enhanced international competitiveness in low-power devices and ultra-high-resolution imaging technology, opening up possibilities for applications in digital cameras, security systems, medical and industrial image sensors, as well as future ultra-high-resolution sensors for autonomous driving, aerospace, and satellite observation.
Professor Sang Hyun Kim, the lead researcher, commented, “This research demonstrates that significantly higher performance than existing technologies can be achieved even with ultra-thin absorption layers.”
< Figure 3. Top optical microscope image and cross-sectional scanning electron microscope image of the InGaAs photodiode image sensor fabricated on the GMR structure (left). Improved quantum efficiency performance of the ultra-thin image sensor (red) fabricated with the technology proposed in this study (right) >
The results of this research were published on 15th of November, in the prestigious international journal Light: Science & Applications (JCR 2.9%, IF=20.6), with Professor Dae-Myung Geum of Inha University (formerly a KAIST postdoctoral researcher) and Dr. Jinha Lim (currently a postdoctoral researcher at Yale University) as co-first authors. (Paper title: “Highly-efficient (>70%) and Wide-spectral (400 nm -1700 nm) sub-micron-thick InGaAs photodiodes for future high-resolution image sensors”)
This study was supported by the National Research Foundation of Korea.
2024.11.22 View 11609 -
A 20-year-old puzzle solved: KAIST research team reveals the 'three-dimensional vortex' of zero-dimensional ferroelectrics
Materials that can maintain a magnetized state by themselves without an external magnetic field (i.e., permanent magnets) are called ferromagnets. Ferroelectrics can be thought of as the electric counterpart to ferromagnets, as they maintain a polarized state without an external electric field. It is well-known that ferromagnets lose their magnetic properties when reduced to nano sizes below a certain threshold. What happens when ferroelectrics are similarly made extremely small in all directions (i.e., into a zero-dimensional structure such as nanoparticles) has been a topic of controversy for a long time.
< (From left) Professor Yongsoo Yang, the corresponding author, and Chaehwa Jeong, the first author studying in the integrated master’s and doctoral program, of the KAIST Department of Physics >
The research team led by Dr. Yongsoo Yang from the Department of Physics at KAIST has, for the first time, experimentally clarified the three-dimensional, vortex-shaped polarization distribution inside ferroelectric nanoparticles through international collaborative research with POSTECH, SNU, KBSI, LBNL and University of Arkansas.
About 20 years ago, Prof. Laurent Bellaiche (currently at University of Arkansas) and his colleagues theoretically predicted that a unique form of polarization distribution, arranged in a toroidal vortex shape, could occur inside ferroelectric nanodots. They also suggested that if this vortex distribution could be properly controlled, it could be applied to ultra-high-density memory devices with capacities over 10,000 times greater than existing ones. However, experimental clarification had not been achieved due to the difficulty of measuring the three-dimensional polarization distribution within ferroelectric nanostructures.
The research team at KAIST successfully solved this 20-year-old challenge by implementing a technique called atomic electron tomography. This technique works by acquiring atomic-resolution transmission electron microscope images of the nanomaterials from multiple tilt angles, and then reconstructing them back into three-dimensional structures using advanced reconstruction algorithms. Electron tomography can be understood as essentially the same method with the CT scans used in hospitals to view internal organs in three dimensions; the KAIST team adapted it uniquely for nanomaterials, utilizing an electron microscope at the single-atom level.
< Figure 1. Three-dimensional polarization distribution of BaTiO3 nanoparticles revealed by atomic electron tomography. >(Left) Schematic of the electron tomography technique, which involves acquiring transmission electron microscope images at multiple tilt angles and reconstructing them into 3D atomic structures.(Center) Experimentally determined three-dimensional polarization distribution inside a BaTiO3 nanoparticle via atomic electron tomography. A vortex-like structure is clearly visible near the bottom (blue dot).(Right) A two-dimensional cross-section of the polarization distribution, thinly sliced at the center of the vortex, with the color and arrows together indicating the direction of the polarization. A distinct vortex structure can be observed.
Using atomic electron tomography, the team completely measured the positions of cation atoms inside barium titanate (BaTiO3) nanoparticles, a well-known ferroelectric material, in three dimensions. From the precisely determined 3D atomic arrangements, they were able to further calculate the internal three-dimensional polarization distribution at the single-atom level. The analysis of the polarization distribution revealed, for the first time experimentally, that topological polarization orderings including vortices, anti-vortices, skyrmions, and a Bloch point occur inside the 0-dimensional ferroelectrics, as theoretically predicted 20 years ago. Furthermore, it was also found that the number of internal vortices can be controlled depending on their sizes.
Prof. Sergey Prosandeev and Prof. Bellaiche (who proposed with other co-workers the polar vortex ordering theoretically 20 years ago), joined this collaboration and further proved that the vortex distribution results obtained from experiments are consistent with theoretical calculations.
By controlling the number and orientation of these polarization distributions, it is expected that this can be utilized into next-generation high-density memory device that can store more than 10,000 times the amount of information in the same-sized device compared to existing ones.
Dr. Yang, who led the research, explained the significance of the results: “This result suggests that controlling the size and shape of ferroelectrics alone, without needing to tune the substrate or surrounding environmental effects such as epitaxial strain, can manipulate ferroelectric vortices or other topological orderings at the nano-scale. Further research could then be applied to the development of next-generation ultra-high-density memory.”
This research, with Chaehwa Jeong from the Department of Physics at KAIST as the first author, was published online in Nature Communications on May 8th (Title: Revealing the Three-Dimensional Arrangement of Polar Topology in Nanoparticles).
The study was mainly supported by the National Research Foundation of Korea (NRF) Grants funded by the Korean Government (MSIT).
2024.05.31 View 12368 -
KAIST builds a high-resolution 3D holographic sensor using a single mask
Holographic cameras can provide more realistic images than ordinary cameras thanks to their ability to acquire 3D information about objects. However, existing holographic cameras use interferometers that measure the wavelength and refraction of light through the interference of light waves, which makes them complex and sensitive to their surrounding environment.
On August 23, a KAIST research team led by Professor YongKeun Park from the Department of Physics announced a new leap forward in 3D holographic imaging sensor technology.
The team proposed an innovative holographic camera technology that does not use complex interferometry. Instead, it uses a mask to precisely measure the phase information of light and reconstruct the 3D information of an object with higher accuracy.
< Figure 1. Structure and principle of the proposed holographic camera. The amplitude and phase information of light scattered from a holographic camera can be measured. >
The team used a mask that fulfills certain mathematical conditions and incorporated it into an ordinary camera, and the light scattered from a laser is measured through the mask and analyzed using a computer. This does not require a complex interferometer and allows the phase information of light to be collected through a simplified optical system. With this technique, the mask that is placed between the two lenses and behind an object plays an important role. The mask selectively filters specific parts of light,, and the intensity of the light passing through the lens can be measured using an ordinary commercial camera. This technique combines the image data received from the camera with the unique pattern received from the mask and reconstructs an object’s precise 3D information using an algorithm.
This method allows a high-resolution 3D image of an object to be captured in any position. In practical situations, one can construct a laser-based holographic 3D image sensor by adding a mask with a simple design to a general image sensor. This makes the design and construction of the optical system much easier. In particular, this novel technology can capture high-resolution holographic images of objects moving at high speeds, which widens its potential field of application.
< Figure 2. A moving doll captured by a conventional camera and the proposed holographic camera. When taking a picture without focusing on the object, only a blurred image of the doll can be obtained from a general camera, but the proposed holographic camera can restore the blurred image of the doll into a clear image. >
The results of this study, conducted by Dr. Jeonghun Oh from the KAIST Department of Physics as the first author, were published in Nature Communications on August 12 under the title, "Non-interferometric stand-alone single-shot holographic camera using reciprocal diffractive imaging".
Dr. Oh said, “The holographic camera module we are suggesting can be built by adding a filter to an ordinary camera, which would allow even non-experts to handle it easily in everyday life if it were to be commercialized.” He added, “In particular, it is a promising candidate with the potential to replace existing remote sensing technologies.”
This research was supported by the National Research Foundation’s Leader Research Project, the Korean Ministry of Science and ICT’s Core Hologram Technology Support Project, and the Nano and Material Technology Development Project.
2023.09.05 View 14431