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Professor Kyung-Wook Paik Receives the Best Presentation Award from 2014 Pan Pacific Symposium
The Surface Mount Technology Association (SMTA) hosted its 19th Annual Pan Pacific Microelectronics Symposium on February 11-13, 2014 in Hawaii.
The 2014 conference, promoting international technical exchange and extensive networking among microelectronics professionals from around the world, presented over 50 papers from 17 countries.
Professor Kyung-Wook Paik of Materials Science Engineering at KAIST received the Best Presentation Award for his paper titled, “Novel Nanofiber Anisotropic Films for Nine Pitch Assembly” at the conference.
SMTA is an international network of professionals in electronics assembly technologies, including Microsystems, emerging technologies, and related business operations.
2014.03.17 View 8377 -
Professor Kyung Wook Baek Wins the Best Thesis Award at the 2012 Pan-Pacific Microelectronic Symposium
Prof. Kyung Wook Baek from KAIST"s material science department has won the Best Thesis Award at the 2012 Pan-Pacific Microelectronic Symposium.
The title of this thesis was "Recent Advances in Anisotropic Conductive Adhesives Technology : Materials and Processes". Prof Baek had the honor of having his thesis be appointed the best thesis of the symposium.
This thesis includes his 15 years of research on ACAs which are a key element of display and semiconductor packaging technology.
Prof. Baek"s research results has been recognized as incredibly innovative in the field of ACAs and ultrasonic connection devices. This thesis has been recognized as setting the foundation for commercialization by professionals from all over the world at the symposium.
Prof. Baek has announced two innovative technologies on ACAs at the symposium.
One is a technology that merges the nanofiber technology with the ATAs. This technology was highly applauded for overcoming the problem of electric connection in micro-pitch display semiconductors, and successfully applying this to electronic packaging materials.
Currently, commercialization process based on the patent is ongoing. It is expected that we will be able to take hold of the entire market once the commercialization succeeds.
The other technology was to improve the liability and overcome the limits of the current flow in ACAs through the use of solder molecules. This is also undergoing commercialization process for use in mobile electronic devices.
Together with this, Prof.Baek has reported an innovative case where the original heat compression process was replaced with a new ultrasonic process. This discovery is deemed to be extremely great due to its implications in replacing all heat compression systems. This too will soon be commercialized
Prof.Baek has played a crucial role in the development of electronic packaging material and processing technology. He has written the largest number of theses in this area, and has proven himself to be the world"s best through winning this award.
2012.05.10 View 9424