Prof. Kyung Wook Baik of KAIST and his research team in the Department of Materials Science and Engineering announced the launch of a joint research project with Nokia, the world"s leading mobile phone supplier, on Jan. 24.
It is the first time that Nokia runs a joint research project with a Korean university or research institute.
Under the agreement, KAIST will develop a new ultrasonic welding process to bond various modules for mobile phones. The ultrasonic welding process, an indigenous technology patented by the research team led by Prof. Baik, is expected to contribute greatly to improving productivity in manufacturing mobile phones, as well as making it smaller and lighter.
The research period is six month and the project fund amounts to 35,000 euros.