Ki-Won Lee Receives Best Student Paper Award
Ki-Won Lee, a doctoral student of Materials Science & Engineering, has received the Best Student Paper Award ‘Motorola Fellowship Award’ at 2007 Electronic Components and Technology Conference (ECTC).
Lee’s paper is about a new bonding process of anisotropic conductive film using ultrasonic wave, which applies ultrasonic wave, instead of thermal compression, at the room temperature to reduce the process time from ten to three seconds.
The recipients of Motorola Fellowship Award are selected by IEEE Components, Packaging and Manufacturing Technology Society, and Motorola awards special scholarship to recipients. The ECTC is the world’s largest yearly conference concerning electronic packaging technologies with more than 1,000 attendees and more than 300 presented papers.
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