Electronic+Components+and+Technology+Conference
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Tae-Wan Kim, a doctoral candidate, receives the best paper award from ECTC
The 2014 Electronic Components and Technology Conference (ECTC) will take place on May 27-30 in Florida, USA. Tae-Wan Kim, a Ph.D. candidate at the Department of Materials Science Engineering (MSE), KAIST, will receive the Intel Best Student Paper Award at the conference.ECTC is the premier international conference that brings together the best researchers and engineers in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. The conference is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of IEEE (Institute of Electrical and Electronics Engineering).The paper describes research on novel nanofiber anisotropic conductive films for ultra fine pitch electronic package application, which was written under the guidance of Professor Kyung-Wook Paik of the MSE Department. In the past ten years, two of his students have received the best paper award from ECTC.
2014.03.14 View 8438 -
Ki-Won Lee Receives Best Student Paper Award
Ki-Won Lee Receives Best Student Paper Award
Ki-Won Lee, a doctoral student of Materials Science & Engineering, has received the Best Student Paper Award ‘Motorola Fellowship Award’ at 2007 Electronic Components and Technology Conference (ECTC).
Lee’s paper is about a new bonding process of anisotropic conductive film using ultrasonic wave, which applies ultrasonic wave, instead of thermal compression, at the room temperature to reduce the process time from ten to three seconds.
The recipients of Motorola Fellowship Award are selected by IEEE Components, Packaging and Manufacturing Technology Society, and Motorola awards special scholarship to recipients. The ECTC is the world’s largest yearly conference concerning electronic packaging technologies with more than 1,000 attendees and more than 300 presented papers.
2007.07.02 View 14528