Nano+Packaging
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New Anisotropic Conductive Film for Ultra-Fine Pitch Assembly Applications
(Professor Paik(right) and PhD Candidate Yoon)
Higher resolution display electronic devices increasingly needs ultra-fine pitch assemblies. On that account, display driver interconnection technology has become a major challenge for upscaling display electronics.
Researchers have moved to one step closer to realizing ultra-fine resolution for displays with a novel thermoplastic anchoring polymer layer structure. This new structure can significantly improve the ultra-fine pitch interconnection by effectively suppressing the movement of conductive particles. This film is expected to be applied to various mobile devices, large-sized OLED panels, and VR, among others.
A research team under Professor Kyung-Wook Paik in the Department of Materials developed an anchoring polymer layer structure that can effectively suppress the movement of conductive particles during the bonding process of the anisotropic conductive films (ACFs). The new structure will significantly improve the conductive particle capture rate, addressing electrical short problems in the ultra-fine pitch assembly process.
During the ultra-fine pitch bonding process, the conductive particles of conventional ACFs agglomerate between bumps and cause electrical short circuits. To overcome the electrical shortage problem caused by the free movement of conductive particles, higher tensile strength anchoring polymer layers incorporated with conductive particles were introduced into the ACFs to effectively prevent conductive particle movement.
The team used nylon to produce a single layer film with well-distributed and incorporated conductive particles. The higher tensile strength of nylon completely suppressed the movement of conductive particles, raising the capture rate of conductive particles from 33% of the conventional ACFs to 90%. The nylon films showed no short circuit problem during the Chip on Glass assembly. Even more, they obtained excellent electrical conductivity, high reliability, and low cost ACFs during the ultra-fine pitch applications.
Professor Paik believes this new type of ACFs can further be applied not only to VR, 4K and 8K UHD display products, but also to large-size OLED panels and mobile devices.
His team completed a prototype of the film supported by the ‘H&S High-Tech,’ a domestic company and the ‘Innopolis Foundation.’ The study, whose first author is PhD candidate Dal-Jin Yoon, is described in the October issue of IEEE TCPMT.
Figure 1: Schematic process of APL structure fabrication.
Figure 2: Proto-type production of APL ACFs.
2018.11.13 View 5626 -
A Technology Holding Company Establishes Two Companies Based on Technologies Developed at KAIST
Mirae Holdings is a technology holding company created by four science and technology universities, KAIST, DIGIST (Daegu Gyeongbuk Institute of Science and Technology), GIST (Gwangju Institute of Science and Technology), and UNIST (Ulsan National Institute of Science and Technology) in 2014 to commercialize the universities’ research achievements. The company identifies promising technologies for commercialization, makes business plans, establishes venture capitals, and invests in startup companies.
Over the past year, Mirae Holdings has established two venture companies based on the technologies developed at KAIST. In September 2014, it founded Cresem Inc., a company used the anisotropic conductive film (ACF) bonding technology, which was developed by Professor Kyung-Wook Paik of the Material Science and Engineering Department at KAIST. Cresem provides a technology to bond electronic parts ultrasonically. The company is expected to have 860,000 USD worth of sales within the first year of its launching.
Last June, Mirae Holdings created another company, Doctor Kitchen, with the technology developed by Professor Gwan-Su Yi of the Bio and Brain Engineering Department at KAIST. Doctor Kitchen supplies precooked food, which helps diabetic patients regulate their diet. The company offers a personalized diet plan to customers so that they can effectively manage their disease and monitor their blood sugar level efficiently.
The Chief Executive Officer of Mirae Holdings, Young-Ho Kim, said, “We can assist KAIST researchers who aspire to create a company based on their research outcomes through various stages of startup services such as making business plans, securing venture capitals, and networking with existing businesses.”
Young-Ho Kim (left in the picture), the Chief Executive Officer of Mirae Holdings, holds a certificate of company registration with Sang-Min Oh (right in the picture), the Chief Executive Officer of Cresem.
Young-Ho Kim (left in the picture), the Chief Executive Officer of Mirae Holdings, holds a certificate of company registration with Jae-Yeun Park (right in the picture), the Chief Executive Officer of Dr. Kitchen.
2015.07.29 View 10746 -
A Step Closer to Ultra Slim Mobile Phone
Professor Baek Kyung Wook (department of Material Science and Engineering) succeeded in developing an ultra-thin conjugation technique that can perfectly replace the modular contact in electronic devices.
The research team developed a compound material using ultra-fine solder-adhesive film and developed the vertical ultrasonic conjugation process thereby making a reliable utra-thin conjugation.
The developed technique allowed for very thin and reliable conjugation and will be able to replace the socket type connector and is expected to revolutionize the electronic device industry.
In mobile electronic devices like the smartphone, the trend is to incorporate various functional modules like camera, display, touchscreens, etc. in addition to striving for miniaturization of the device.
Recently the problem was the fact that the number of modules within the device was increasing due to the incorporation of various functions, and consequently the volume that these modules took up increased as well, which made miniaturization almost impossible.
Professor Baek‘s team succeeded in improving upon this problem by creating a compound material that has ultra-fine solder particles that can melt to form alloy fusion with the electrode and thermosetting adhesive film that can wrap around the electrode and provide mechanical protection.
The use of this material made it possible to reduce the thickness of the connector by hundredth fold which improved electrical, mechanical properties and highly reliable.
From a processing standpoint the conventional conjugation process involved heating the mechanical block and was therefore hard to manage its production and also consumed 1000W and took up to 15 seconds.
By contrast, Professor Baek’s team’s new process uses only ultrasound to locally heat and melt the conjugation point itself thereby reducing power consumption to 100W and conjugation time to 1~5 seconds.
The technique developed by Professor Baek and Lee Ki Won Doctorate student was awarded Excellent Dissertation Award by world famous journals like the Electronic Components and Technology Conference and is being recognized worldwide.
2012.01.31 View 8715